JPH0558889B2 - - Google Patents
Info
- Publication number
- JPH0558889B2 JPH0558889B2 JP2031788A JP3178890A JPH0558889B2 JP H0558889 B2 JPH0558889 B2 JP H0558889B2 JP 2031788 A JP2031788 A JP 2031788A JP 3178890 A JP3178890 A JP 3178890A JP H0558889 B2 JPH0558889 B2 JP H0558889B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- upper mold
- semiconductor wafer
- lower mold
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920005989 resin Polymers 0.000 claims description 89
- 239000011347 resin Substances 0.000 claims description 89
- 239000004065 semiconductor Substances 0.000 claims description 34
- 238000002347 injection Methods 0.000 claims description 19
- 239000007924 injection Substances 0.000 claims description 19
- 238000000465 moulding Methods 0.000 claims description 13
- 239000013013 elastic material Substances 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 9
- WZKSXHQDXQKIQJ-UHFFFAOYSA-N F[C](F)F Chemical compound F[C](F)F WZKSXHQDXQKIQJ-UHFFFAOYSA-N 0.000 claims description 3
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- ZQXCQTAELHSNAT-UHFFFAOYSA-N 1-chloro-3-nitro-5-(trifluoromethyl)benzene Chemical compound [O-][N+](=O)C1=CC(Cl)=CC(C(F)(F)F)=C1 ZQXCQTAELHSNAT-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2031788A JPH03234605A (ja) | 1990-02-13 | 1990-02-13 | レジン成形装置 |
| US07/634,447 US5151276A (en) | 1990-02-13 | 1990-12-27 | Resin molding apparatus |
| EP90125822A EP0442152A1 (en) | 1990-02-13 | 1990-12-31 | Resin molding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2031788A JPH03234605A (ja) | 1990-02-13 | 1990-02-13 | レジン成形装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03234605A JPH03234605A (ja) | 1991-10-18 |
| JPH0558889B2 true JPH0558889B2 (en]) | 1993-08-27 |
Family
ID=12340804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2031788A Granted JPH03234605A (ja) | 1990-02-13 | 1990-02-13 | レジン成形装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US5151276A (en]) |
| EP (1) | EP0442152A1 (en]) |
| JP (1) | JPH03234605A (en]) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR970002295B1 (ko) * | 1993-02-23 | 1997-02-27 | 미쯔비시 덴끼 가부시끼가이샤 | 성형방법 |
| NL9400119A (nl) * | 1994-01-27 | 1995-09-01 | 3P Licensing Bv | Werkwijze voor het met een hardende kunststof omhullen van een electronische component, electronische componenten met kunststofomhulling verkregen door middel van deze werkwijze en matrijs voor het uitvoeren der werkwijze. |
| US5597523A (en) * | 1994-02-22 | 1997-01-28 | Mitsubishi Denki Kabushiki Kaisha | Molding apparatus and method in which a mold cavity gasket is deformed by separately applied pressure |
| US5656550A (en) * | 1994-08-24 | 1997-08-12 | Fujitsu Limited | Method of producing a semicondutor device having a lead portion with outer connecting terminal |
| DE69501632T2 (de) * | 1994-11-21 | 1998-07-23 | Apic Yamada Corp | Harzformmaschine mit Trennfolie |
| MY114536A (en) * | 1994-11-24 | 2002-11-30 | Apic Yamada Corp | A resin molding machine and a method of resin molding |
| US5846477A (en) * | 1994-12-08 | 1998-12-08 | Nitto Denko Corporation | Production method for encapsulating a semiconductor device |
| WO1996020075A1 (en) * | 1994-12-23 | 1996-07-04 | Amoco Corporation | Improved process for making preforms useful for encapsulating semiconductors |
| JP3246848B2 (ja) * | 1995-02-22 | 2002-01-15 | アピックヤマダ株式会社 | 汎用ゲート位置樹脂モールド装置および樹脂モールド方法 |
| EP0742586A3 (en) * | 1995-05-02 | 1998-03-11 | Texas Instruments Incorporated | Improvements in or relating to integrated circuits |
| US5800747A (en) * | 1996-07-02 | 1998-09-01 | Motorola, Inc. | Method for molding using an ion implanted mold |
| SE508968C2 (sv) * | 1996-12-19 | 1998-11-23 | Ericsson Telefon Ab L M | Förfarande för att göra elastiska kulor |
| TW345709B (en) * | 1997-09-18 | 1998-11-21 | Siliconware Precision Industries Co Ltd | Method for encapsulating substrate-based electronic device |
| US6096250A (en) * | 1998-03-06 | 2000-08-01 | Caesar International, Inc. | Process for releasing a runner from an electronic device package on a laminate plate |
| US6523803B1 (en) | 1998-09-03 | 2003-02-25 | Micron Technology, Inc. | Mold apparatus used during semiconductor device fabrication |
| US7026710B2 (en) | 2000-01-21 | 2006-04-11 | Texas Instruments Incorporated | Molded package for micromechanical devices and method of fabrication |
| US6489178B2 (en) * | 2000-01-26 | 2002-12-03 | Texas Instruments Incorporated | Method of fabricating a molded package for micromechanical devices |
| US7595017B2 (en) * | 2002-01-31 | 2009-09-29 | Stmicroelectronics, Inc. | Method for using a pre-formed film in a transfer molding process for an integrated circuit |
| CA2415928C (en) * | 2003-01-02 | 2010-08-24 | Straw Track Manufacturing Inc. | Pivoting arm for seeders and the like |
| US20040194803A1 (en) * | 2003-04-04 | 2004-10-07 | Asm Technology Singapore Pte Ltd | Cleaning of an electronic device |
| BRPI0908323A2 (pt) * | 2008-05-05 | 2018-07-17 | Dow Global Technologies Inc | método para poduzir um artigo sobremoldado |
| EP2652799A2 (en) | 2010-12-17 | 2013-10-23 | Dow Global Technologies LLC | Improved photovoltaic device |
| TWI565105B (zh) * | 2012-07-09 | 2017-01-01 | 山田尖端科技股份有限公司 | 樹脂模塑裝置以及樹脂模塑方法 |
| US20240261815A1 (en) * | 2023-02-08 | 2024-08-08 | Sonoco Development, Inc. | Coating devices and method for articles |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1271833A (en) * | 1968-07-10 | 1972-04-26 | Hitachi Ltd | Improvements in or relating to encapsulation processes |
| US3641254A (en) * | 1969-06-27 | 1972-02-08 | W S Electronic Services Corp | Microcircuit package and method of making same |
| JPS5433665A (en) * | 1977-08-22 | 1979-03-12 | Hitachi Ltd | Manufacture for resin sealed type semiconductor device and resin sealed metal mold |
| DE2937605C2 (de) * | 1979-09-18 | 1985-05-09 | Kontec GmbH Konstruktion + Technik im Maschinenbau, 6710 Frankenthal | Formvorrichtung zum Umspritzen oder Umgießen des Randes eines flächigen Bauteiles |
| JPS5964318A (ja) * | 1982-10-05 | 1984-04-12 | Asahi Chem Ind Co Ltd | 変性オレフイン樹脂の回転成形法 |
| US4618322A (en) * | 1983-06-24 | 1986-10-21 | Plastek Corporation | Reaction injection molding system with finger gate |
| JPS6367131A (ja) * | 1987-05-01 | 1988-03-25 | Asahi Glass Co Ltd | モ−ルあるいはガスケツトを形成する方法 |
| JPS6367126A (ja) * | 1987-05-01 | 1988-03-25 | Asahi Glass Co Ltd | モ−ルあるいはガスケツトを形成する方法 |
| US4881885A (en) * | 1988-04-15 | 1989-11-21 | International Business Machines Corporation | Dam for lead encapsulation |
-
1990
- 1990-02-13 JP JP2031788A patent/JPH03234605A/ja active Granted
- 1990-12-27 US US07/634,447 patent/US5151276A/en not_active Expired - Lifetime
- 1990-12-31 EP EP90125822A patent/EP0442152A1/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| EP0442152A1 (en) | 1991-08-21 |
| US5151276A (en) | 1992-09-29 |
| JPH03234605A (ja) | 1991-10-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070827 Year of fee payment: 14 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080827 Year of fee payment: 15 |
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| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090827 Year of fee payment: 16 |
|
| LAPS | Cancellation because of no payment of annual fees |